Liquid cooled plate

The working principle of the liquid cooling plate: The heat sink accurately locates the hot spots of the CPU and GPU through thermal simulation technology. The liquid flows through the cold plate channel design and rubs against the inner surface of the heat sink to remove a large amount of heat, providing targeted cooling for the chip and a stable working temperature for the chip. During use, high-quality, reusable, and cost-effective liquids should be selected as much as possible to maintain their efficient heat dissipation capabilities. Suitable for heat dissipation of ultra-high power components that cannot be cooled by air, such as CPUs GPU、 Memory modules, etc; Charging stations, batteries, power sources, medical, laser, radar, etc.